The Automotive Grade X series (FT-CAP) MLCC in X7R dielectric incorporates a unique, flexible termination system that is integrated with KEMET"s standard termination materials. A conductive silver epoxy is utilized between the base metal and nickel barrier layers of KEMET"s standard termination system in order to establish pliability while maintaining terminal strength, solderability and electrical performance. This technology was developed in order to address the primary failure mode of MLCCs- flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Flexible termination technology mitigates flex cracks which can result in low IR or short circuit failures. These flexrobust devices offer up to 5mm of flex-bend capability and exhibit a predictable change in capacitance with respect to time and voltage. Capacitance change with reference to ambient temperature is limited to ±15% from -55°C to +125°C.